Acrosemi Corporation draws upon 25 years of experience to offer a broad range of the world's leading innovative products and turn-key solutions used in the development and production of microelectronic devices for the semiconductor,
photonics, hybrid, microlithography, surface mount techonology (SMT) and printed circuit industries, dicing saws and laser scribing systems, dicing blades and processes used in the dicing of silicon-based ICs, hard material Microelectronic Components (MECs) and in package singulation, and also for soldering, brazing and glass sealing of microelectronic packages and components.
In addition, we can also assist in Turnkey Solutions for:
Surface Mount Assembly and Test Production Line.
Microwave, Hybrid Assembly, and Test Production Line.
Nanotech, MEMS Assembly, and Test Production Line.
Photonics, IC, RF Assembly, and Test Production Line.
Thick/Thin Film Assembly Line.
MEMS Package Sealing Line.
Hermetic Package Sealing Line.
Full range of Microelectronics Test, Assembly, and Packaging Line.
AUTOMA VIETNAM 2008
Vietnam Exhibition Fair Centre – 148 Giang Vo Road, Hanoi, Vietnam
(Visit us at Booth #132)
Vietnam Technology Business Mixer (VTBM)
Sumerset Hotel, Vietnam www.smtvietnam.com VTBM Photos Gallery: Click here to view more photos! Acrosemi - As seen on TV See VIDEOs! NEPCON VIETNAM 2008
Hanoi International Center for Exhibition (I.C.E.) Cultural Palace Hanoi, Vietnam. (Booth No. C19) www.nepconvietnam.com
Phu Tho Sport Centre
01 Lu Gia, District 11, Ho Chi Minh City, Vietnam
(Booth No. 7, 8, 9 & 58, 59, 60) E-News TechMart Hanoi 2007
Vietnam Exhibition Fair
148 Giang Vo,
(Booth No. 123)