AcroSemi Corp. - Vietnam's leading supplier of semiconductor interconnect assembly equipment...

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vietnam semiconductor company
vietnam leading supplier of semiconductor
vietnam semiconductor manufacturing
vietnam microelectronics company, industry
semiconductor news, wafer inspection,wafer bonders
wafer mounters,dicing saws,curing ovens,reflow ovens
stress testing, electrostatic discharge ESD
vietnam tradeshow,vietnam outsourcing
vietnam electronic contract manufacturing
semicon vietnam, world best, world leading
vietnam top manufacturers supplier import export
vietnam semiconductor forecast
vietnam photovoltaic, solar cell
vietnam Surface Mount Assembly, smt,clean room
Trident Defluxing Systems,Stencil Cleaning Systems
vietnam Nanotech,MEMS Assembly
vietnam smt,probe station
vietnam test equipment,lab equipment
world’s fastest wire bonder,die bonder
assembly equipment,packaging equipment
material handling equipment
best rework system, rework BGA station
intel wire die bonder,intel vietnam
hybrids,optoelectronics,microwave,fiber optic-laser
saw devices,power devices,radio frequency
ic chip packaging, backend assembly
dicing saws, dicing tools, laser scribing
complete dicing solution, solder reflow systems
we offer die and wire bonding services
fast turnaround prototypes
advanced manufacturing, micropackaging
inspection & test, nepcon vietnam, optoelectronics, vietnam opto
smt equipment, PCB assembly equipment
turnkey-equipment solutions,semiconductor equipment
RFID,Hybrids,IC,Photonics,RF,MEMS
Wafer & Die Inspection,Device Characterization,ESD
Failure Analysis,HF/Microwave
Known Good Die (KGD),Microfluidics
Nanotechnology,Optoelectronic,Photovoltaic
Pin to Pad,PCB & Substrate Testing
Silicon Laser Microsurgery,Vacuum probing
Wafer Level Reliability (WLR)

Wafer Saw (Dicing) Equipment

Mold Die

Vacuum Sealers

Die Attach Machines

Hermetic Sealing Equipment

Wire Bonders

High-volume Soldering, Brazing and Glass Sealing

Screen Printers

Full-Line SMT

AOI & X-Ray

Rework System

Defluxing Systems

Stencil Cleaning Systems

Reflow Solder/Curing System

Reliability, Process, Wet Benches

Mask Aligners

Probe Stations

Wafer Inspection System

Wafer Mounters

Wafer Bonders

Testing & Inspection

Temperature Testing Systems

Product and Package Testing Equipment

Cleanliness Testers

UV Curable Dicing Tape & UV Exposure System

Ovens

Chambers

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Acrosemi Corporation draws upon 25 years of experience to offer a broad range of the world's leading innovative products and turn-key solutions used in the development and production of microelectronic devices for the semiconductor, photonics, hybrid, microlithography, surface mount techonology (SMT) and printed circuit industries, dicing saws and laser scribing systems, dicing blades and processes used in the dicing of silicon-based ICs, hard material Microelectronic Components (MECs) and in package singulation, and also for soldering, brazing and glass sealing of microelectronic packages and components.

In addition, we can also assist in Turnkey Solutions for:

Surface Mount Assembly and Test Production Line.

Microwave, Hybrid Assembly, and Test Production Line.

Nanotech, MEMS Assembly, and Test Production Line.

Photonics, IC, RF Assembly, and Test Production Line.

Thick/Thin Film Assembly Line.
MEMS Package Sealing Line.
Hermetic Package Sealing Line.
Full range of Microelectronics Test, Assembly, and Packaging Line.
Full range of Dicing Solutions.

Manual Wire Bonding (close up photo, bonding wire size is 25.4 microns)

	Why Acrosemi
	Turnkey solutions Best delivery and best customer service Easy-to-use and out-of- the-box products Faster, more reliable and expandable solutions Dedicated support department

	News / Events
	Apple Becomes World’s Largest ... Chips sees 25% surge in solar, wind RF Application Special "Thank You" Offer from ACROSEMI VIETNAM ACROSEMI at NEPCON VIETNAM Acrosemi Corporation Named SemiProbe Representative Worldwide Semiconductor Equipment Sales to Grow 53% in 2010 Acrosemi is proud to sponsor The 6th Vietnam National Conference on Solid State Physics and Material Science (SPMS-2009) Da Nang, Vietnam Acrosemi Attends Vietnam Electronics Industries Association (VEIA)'s Meeting for Term 2009-2013 Acrosemi Wins 2009 Frost & Sullivan Emerging Company Award NEPCON VIETNAM 2009 Hanoi International Center for Exhibition (I.C.E.) 91 Tran Hung Dao St., Hanoi www.nepconvietnam.com VIETNAM OPTO 2008 Ho Chi Minh City, Vietnam AUTOMA VIETNAM 2008 Vietnam Exhibition Fair Centre – 148 Giang Vo Road, Hanoi, Vietnam (Visit us at Booth #132) Vietnam Technology Business Mixer (VTBM) Sumerset Hotel, Vietnam www.smtvietnam.com VTBM Photos Gallery: Click here to view more photos! Acrosemi - As seen on TV See VIDEOs! NEPCON VIETNAM 2008 Hanoi International Center for Exhibition (I.C.E.) Cultural Palace Hanoi, Vietnam. (Booth No. C19) www.nepconvietnam.com ECIT 2007 Phu Tho Sport Centre 01 Lu Gia, District 11, Ho Chi Minh City, Vietnam (Booth No. 7, 8, 9 & 58, 59, 60) E-News TechMart Hanoi 2007 Vietnam Exhibition Fair 148 Giang Vo, Hanoi, Vietnam (Booth No. 123)

West·Bond manufactures wire bonders, die bonders, die attach, epoxy die attach, and pull tester for the semiconductor industry. Levels of automation vary from completely manual to fully automatic. Click here for more information.

SemiProbe is a global supplier of probing and testing solutions for microelectronics, solar applications, optoelectronics, MEMS, biotechnology, chemistry, microfluidics, and nanotechnology. Our goal is to provide industry with access to the latest high quality test technology to help lower the cost of test. Click here for more information.

Semiconductor Equipment Corporation (SEC) manufactures manual and semiautomatic assembly, rework, handling and test equipment used in development and production of microelectronic devices for the semiconductor, hybrid and printed circuit industries. Equipment ranges from flip chip die bonders, die handling equipment, rework systems, test equipment, pick and place systems, wafer and die tape to mounting equipment. Click here for more information.

SST International is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over twenty-five years, SST has provided flux-free and void-free soldering, brazing and glass sealing solutions to the world-wide electronics industry. Products include Wafer Bonders, Vacuum/Pressure Furnaces, and Graphite Machining Services. Click here for more information.

YESTech, Inc. is a leading global provider of automated optical inspection (AOI) and high-resolution X-ray inspection systems. The full line of inspection systems offers cost-effective, integrated yield enhancement solutions for the printed circuit board assembly, advanced semiconductor-packaging and hybrid assembly to EMS providers and electronics OEM's worldwide. Click here for more information.

Sikama is one of the world's leading solder reflow systems manufacturers. Our products are used by the major high technology companies in the United States, Europe and Asia. We provide our customers the best services & quality and devote to building long-term relationship with our customers. Click here for more information.

Aqueous Technologies’ Trident Series automatic defluxing and cleanliness testing systems represent best-in-class defluxing technology, as demonstrated by Trident’s eight major industry awards in less than two years. Click here for more information.

Polaris Electronics Corp. offers projection welders and parallel seam sealers for microelectronic and optoelectronic packages, as well as spot welders, lid tackers and other, optional accessories designed to meet every hermetic sealing need. Click here for more information.

Accvacs is a manufacturer of Digital Table Top Impulse & Vacuum Heat Sealers. Our Impulse & Vacuum Sealers are Manufactured in the USA with the most Advanced Electronic & Pneumatic Controls which allows us to offer our customers the best Safety options, the best Seal and the best Warranty in the Industry. Click here for more information.

DeWeyl Tool, Inc. provides the finest quality bonding wedges in the world. DeWeyl's primary business is manufacturing wirebond wedges, die pickup tools, and Custom high precision tooling for the Semiconductor, Aerospace, and Medical Industry. DeWeyl produces wedges made from ceramic, titanium, and tungsten carbide used in bonding Aluminum, Gold, Copper, and Platinum wires. Click here for more information.

Neutronix-Quintel (NXQ) offers a wide selection of mask aligners and automated pattern recognition alignment system. Click here for more information.