Tape for Semiconductor Wafer Dicing
and Hybrid Substrate Sawing
For nearly 30 years Semiconductor Equipment Corporation has set the standard for high quality semiconductor Dicing Tape. We inventory a variety of tapes which are manufactured specifically for semiconductor wafer dicing and for ceramic hybrid substrate sawing. These tapes are also useful for surface protection and many other applications that require an adhesive tape with relatively low adhesion, no adhesive transfer, and the ability to stretch without tearing.
Semiconductor Equipment Corporation's Wafer Dicing Tape is a flexible PVC with synthetic acrylic adhesive bonded to one side. It is tough, has high tear strength and elongation. It is used extensively for Wafer Sawing, Scribing, Expanding. These tapes are available in rolls suitable for all automatic and manual wafer mounting systems where the wafers are being mounted onto tape and film frames.
Tapes are selected for your application based on die size and blade thickness. Small die and hard to cut materials require higher tackiness, while larger die call for lower tackiness. Thicker blades require thicker dicing tape.
Specific Uses - Sawing silicon wafers with smaller die sizes. Adhesion
level is slightly greater than Low Tack-Blue to more firmly hold die to
tape but low enough to easily remove die in the next operation.
Very high adhesive strength
secures wafers firmly during dicing, while allowing for easy removal after exposure.
Low Tack, expandable PVC, 80 um thick P/N 24216 Extra High Tack,
non-expandable Polyethylene, 90 um thick P/N 24339 Super High
Tack, expandable PVC, 85 um
thick Our most popular UV tape P/N 24351 Super High Tack, expandable Polyolefin, 170 um
thick Great for dicing BGA
impurities and adhesion stability make this the perfect tape for your
clean room application.
P/N 24202 Low Tack, 80 um thick P/N
24203 Medium Tack, 80 um thick P/N 24204 High Tack, 80 um thick
P/N 24205 Low Tack, stable over time, 75 um thick P/N 24206
Medium Tack, stable over time, 75 um thick P/N 24207 Low Tack, stable
over time, 110 um thick P/N 24208 Medium Tack, stable over time, 110
um thick P/N 24209 Low Tack, 155 um thick P/N 24211 High Tack, 155