Corporation's Model 3100 & 3150 Wafer/Film Frame Tape Applicators
apply tape with optimal control of temperature and pressure parameters.
Uniform, bubble-free mounting of tape for wafer dicing is the result.
State-of-the-art features make them two of the most advanced systems
available. The Model 3100 handles wafers up to 6" in diameter, while the
Model 3150 handles any size wafer up to 8" in diameter. Both models are so
versatile, they can operate with virtually any film
The captive roller applies the tape to the
wafer and film frame in a manner that excludes entrapped air. The result is
bubble-free tape mounting.
Safe, Accurate Tape Trimming System
The tape cutting system is fast, safe and accurate, using a circular
Uniform Tape Tensioner
The tape is held by the
tensioning frame until it is rolled into contact with the wafer and film frame.
Tape is stretched uniformly in all directions.
Works with All
Standard Film Frames
Frames are accurately positioned against
locating pins and magnets hold the frames in place
Machine Controlled Roller Pressure
The captive roller and spring
loaded platen work together to guarantee repeatable mounting pressure.
Repeatable pressure is important for repeatable adhesion. Spring tension may be
set at various levels.
Closed Loop Temperature Control
digital temperature controller regulates platen temperature up to 75 ? C.
Repeatable mounting temperature is important for repeatable adhesion.
Optional Non-Contact Platen
When it is undesirable for
the face of the wafer to come into contact with the platen, an optional
Non-Contact Platen is available. With the non-contact platen, the wafer is held
in position by vacuum along a narrow ridge around the perimeter. A pressure
backup supports the wafer during the tape application. The majority of the wafer
Optional Static Eliminator
the tape path, this device prevents static electricity from building up in the