Deweyl Tool offers a wide range of Micro-BGA/Tessera bonding tool solutions. We offer a minimum of three material choices for your consideration, Tungsten Carbide, Titanium and Ceramic. However, we highly recommend the ceramic material for best results. We have a large selection of Micro-BGA/Tessera® bonding tool designs. We offer both the cross groove and dimple designs to enhance the ultrasonic coupling. We believe our work with Tessera Inc. allows Deweyl the ability to offer unique solutions to your Micro-BGA package demands.